Eye Diagram Analysis for High-Speed SI Validation
Discover how eye diagrams go beyond compliance testing to reveal signal integrity issues, timing margins, and design flaws, ensuring reliable high-speed communication in PCB systems.
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Stay connected with the latest news, developments, and tips in electronic design
Discover how eye diagrams go beyond compliance testing to reveal signal integrity issues, timing margins, and design flaws, ensuring reliable high-speed communication in PCB systems.
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Allegro X
Design Platform
Explore the challenges of PCB design for software-defined vehicles, from high-speed Ethernet to signal integrity, and learn how to ensure safety and reliability in evolving automotive architectures.
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Discover why PCB routing topology, like layer transitions, vias, and return path quality, matters more for Signal Integrity success than raw data speed.
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Learn the physics behind PDN failures and why high-frequency noise is controlled by mounting inductance, not just capacitance. Discover the key to lower loop impedance.
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Explore PCB design for signal integrity with insights on digital transmission lines, differential pairs, impedance control, and phase matching for high-speed circuits.
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3D PCB Design and Analysis: ECAD/MCAD and Where They Converge
ACCESS EBOOKLearn how PCB button plating works in flexible circuits, how it impacts impedance control and copper thicknesses, and how to clearly define plating intent for your PCB manufacturer.
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RF Design: The Wave of the Future
ACCESS EBOOKExploring the points in the fabrication and assembly processes where electrical testing is warranted.
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There are infinite ways to create a power distribution network. Some are better than others. Make yours better.
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Discover why decoupling capacitor placement becomes a critical challenge in HDI PCB designs. Learn how to overcome constraints like fine-pitch BGAs, stacked microvias, and PDN complexities for optimal
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PDN: Gives Your Board Life
ACCESS EBOOKStruggling with signal integrity in PCB design? Discover how routing topology, via strategy, and stackup choice secretly cause SI failures, with real examples revealing the cause-and-effect chain.
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Achieving PCI-e Compliance: Getting it Right the First Time
ACCESS EBOOKLearn how to optimize thermal design in High Density Interconnect (HDI) PCBs. Explore microvia thermal fields, copper balancing, and heat spreading.
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Understand HDI PCB design by tackling resin flow, glass weave, and dielectric behavior. Prevent defects like voids, skew, and delamination in high-density stackups
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Lost in Transmission: Solving Common Issues in High-Speed Design
ACCESS EBOOKLearn how to route 0.355 mm BGA pitches and design high density interconnect (HDI) PCBs for AI accelerators. Explore stackups, sub-3-mil routing, stacked microvias, and thermal management techniques.
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Learn how HDI PCBs and microvias reshape high-speed signal return paths. Discover critical stitching strategies for DDR5, PCIe Gen5/6, and USB4 to maintain signal integrity in dense BGAs.
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FLEXing Like a PCB Expert
ACCESS EBOOKPCB Designers may multitask on library management but a centralized library will ensure consistent quality of the underlying schematic and board symbols.
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Design For Manufacturing encompasses all of the factors that affect reproducibility and longevity of the bare printed circuit board. Call it “Design For Money!”
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PCB Connectors facilitate our electronics by making it easier to replace modules and join various functions. There is a connector for every purpose.
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Common Sources of BOM Rejection and How to Prevent Them
ACCESS EBOOKPrinted circuit board design cannot proceed without the fundamental building blocks. The PCB library is one thing that will determine the outcome of the layout process
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10 Common DFM Issues and How to Fix Them
ACCESS EBOOKPrevent HDI PCB failures with insights on resin starvation, copper pull-away, and CAF growth. Ensure long-term reliability using Cadence DFM solutions.
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Your Route to Design Success
ACCESS EBOOKHDI promises better signal integrity, but does it deliver? Learn the real electromagnetic impact of microvias, via stubs, differential skew, and reference plane issues in high-speed PCB design.
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